An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.
IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。
The redundancy material defect is an important factor of reducing the yield of IC, it mainly causes circuits to be connection failure.
冗余物缺陷是影响IC晶片成品率下降的重要原因，主要造成电路短路错误。
The function of zero connection and deviation compensationcan be realized in the system. An improved method for measuring iC is presented.
系统可以进行自动零点校准和偏位法补偿，对测试IC提出了新的改进方法。
应用推荐