HOT BONDING LIMITED 公司名称
Pressured Hot-bonding 热压合转印技术
controlled-atmosphere hot-bonding 可控气氛热复合
hot air-thru bonding process 热风粘合法
hot roll bonding 热轧复合
hot-rolling-bonding 热轧复合
Hot isostatic pressing bonding 热等静压扩散焊接
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The hot embossing and bonding machines have been used practically in microfluidic chip automatic fabrication, and the chips have satisfactory quality, precision, repetition and consistency.
塑料微流控芯片热压键合设备已经投入自动化生产，生产的芯片质量、精度、重复性和一致性良好。
This system was introduced in early 1980s to China. Until about 1999, pursuing the Construction Bonding system became hot.
上世纪八十年代初工程担保制度被引入我国，到1999年前后工程担保推行成为热点。
This article introduced the reprocess of polyamide hot melt adhesive for bonding lining cloth of clothing.
具体介绍了服装粘合衬布用聚酰胺热熔胶的后加工。
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