The preparation process of the via hole has simple technology, operability is more convenient than an etching method, and the technology cost is reduced.
本发明过孔的制备过程工艺简单，操作性比通过刻蚀的方法方便，降低了工艺成本。
First, the bottom side of the hole in the wall, skirting board in preparation for the installation of the floor.
首先在墙面底侧钻孔，为安装地板踢脚线做准备。
The preparation method comprises the following steps of: digging the plurality of holes on the heat-resisting insulating thin plate supporter and covering the conducting net on each hole;
制备方法为：在耐高温绝缘薄板支撑体上挖多个孔洞并覆盖一个导电网；
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