The slicing method of the invention is capable of implementing high area utilization efficiency of the photovoltaic wafer.
本发明的切片方法，可以实现更高的光伏晶片的面积利用效率。
It is mainly for slicing solid wood, engineer wood andother composite board, working efficiency is high, and veneer thickness isuniform.
主要用于实木，科技木和复合板材的切片，工作效率高，单板厚度均匀。
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