The slicing method of the invention is capable of implementing high area utilization efficiency of the photovoltaic wafer.
本发明的切片方法，可以实现更高的光伏晶片的面积利用效率。
It is mainly for slicing solid wood, engineer wood andother composite board, working efficiency is high, and veneer thickness isuniform.
主要用于实木，科技木和复合板材的切片，工作效率高，单板厚度均匀。
Using for slicing the toaster. Material is stainless steel and aluminum ally small size, high efficiency, move easily.
用于方形面包的均匀切片，不锈钢及铝合金材料，具体面积小、效率高、移动方便等特点。
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