...高速集成电路? [gap=1709]peed integrated circuit hardware description language, counters, Quartus II 9.0, high-speed integrated circuits ...
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The electric properties of interconnects and packaging are very important for the performance of high-speed integrated circuits.
互连封装结构的电特性对当前高速电路系统的总体性能具有至关重要的作用。
The device could shape the future of high-speed signal processing, integrated circuits, optical communications, supercomputing and other applications.
该装置可以将高速信号处理，集成电路，光通信，超级计算和其它应用的未来具体化。
A full wave analysis of lossy interconnection lines on doped semiconductor substrates in high speed integrated circuits is carried out by means of a finite difference time domain (FDTD) approach.
本文首次利用时域有限差分(FDTD)法分析了高速集成电路芯片内半导体基片上的有耗互连传输线的电特性。
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