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The electric properties of interconnects and packaging are very important for the performance of high-speed integrated circuits.
互连封装结构的电特性对当前高速电路系统的总体性能具有至关重要的作用。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
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