high density packaging 高密度封装 ; 高密度组装
high-density packaging technique 高密度组装技术
high density packaging technique 高密度组装技术
high density electronic packaging 高密度电子组装 ; 高密度电子封装
high packaging density 高组装密度
High density packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
Discussions are made about the modeling and analysis of various structural components in high density packaging. Relative programs have been tailored to suit these methods.
本文对高密度封装中各结构成分的模型建立及分析作了讨论，根据这些方法编制了相应的程序。
Several types of high density packaging and their application prospects are emphatically described.
重点介绍了高密度封装形式及应用前景。
应用推荐