The finite element method was used for analysis of heat stress in chip on board(COB).
本文采用有限元法分析了板上芯片（COB）的热应力分布。
The finite element method was used for analysis of heat stress in chip on board (COB).
本文采用有限元法分析了板上芯片(COB)的热应力分布。
Considering gravity, interfacial shear stress, surface tension and interfacial thermal resistance, the analysis model for annular flow condensation heat transfer in microtube was presented.
本文提出了微圆管内环状流凝结换热的分析模型，考虑了重力、汽液界面剪切力、表面张力以及界面凝结热阻的作用。
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