...以SnAgCu为主流，但SnAgCu 有波焊炉锈孔、产品细线锈蚀、IMC沉积等问题，日本有厂商开始使用SnCu(Ni)替代 (4) 手焊(hand solder) 无铅銲锡 欧洲：46﹪厂商使用SnAgCu、4﹪用SnCu、17%用SnAg、4﹪用SnBi 日本：77﹪厂商使用SnAgCu、12﹪用SnCu、6﹪用SnAg、1﹪...
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The cured material provides excellent protection for solder joints against mechanical and thermal stress such as shock, drop, and vibration in hand-held devices.
该材料在固化后可对手提设备中的焊接部在承受冲击、落下、震动等机械和热应力时提供优异的保护。
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Realising their designs would involve assembling and connecting hundreds or thousands of components by hand, using unreliable solder, and then connecting these dinky little constructions to tens of thousands of light bulbs.
ECONOMIST: Jack Kilby
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