... 格令{英制质量单位,等于l/7000磅,合64.7989毫公克};晶粒 grain (gr) 格令力 grain-force 晶粒取向材料 grain-oriented material ...
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The paper also discussed the mechanism of grain damage and the causes of grinding force variations.
阐述了三种磨粒损伤产生的机理和磨削力变化的成因。
From scanning electron microscope (SEM) and (AFM) atomic force microscope images, it is observed that both grain size and surface roughness are aggrandized greatly after annealing.
从扫描电子显微镜(sem)和原子力显微镜(afm)图像可以观察到,薄膜在退火后其晶粒尺寸和粗糙度都大大增加。
In the compound process of ultrasonic vibration and grain machining, the discontinuous grinding mechanism caused by ultrasonic vibration is the main factor decreasing normal grinding force.
深入研究了超声振动和磨粒切削的复合过程,指出超声振动形成的断续磨削机制是降低法向磨削力的主要原因。
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