This paper introduces that we can reduce Within wafer nonuniformity (WIWNU) to achieve part and full planarization by distributing the speed of polishing head and polis.

介绍了在化学机械抛光过程中，可以通过抛光头与抛光台运动速度关系优化配置，降低晶片表面不均匀度，从而更好地实现晶片局部和全局平坦化。

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Body Styles Tapped full lug or wafer.

阀体类型可钻孔的全凸耳或对夹式。

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Realizing that better processes alone will never overcome these imperfections, the Stanford engineers managed to circumvent the barriers using a unique imperfection-immune design paradigm to produce the first-ever full-wafer-scale digital logic structures that are unaffected by misaligned and mis-positioned CNTs.

ENGADGET: Stanford engineers find work around for barriers to carbon nanotube computers