Through research, choose one or two lead-free solder paste.

通过研究，选择一种或两种无铅锡膏。

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So study lead-free solder paste in the electronic application package is important.

因此研究无铅锡膏在电子封装中的应用具有重要意义。

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This paper describes the development trend of low melting point and high melting point type Lead-free solder paste.

概述了低熔点和高熔点型无铅焊膏的开发动向。

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