The ideal formula of the adhesive is determined by series of experiments and the reaction process and thermal stability of copper foil adhesives are studied by te, TGA and DTA.

通过一系列研究确定了胶粘剂的理想配方，并通过红外光谱、热失重和差热分析法对其铜箔胶粘剂的反应过程和热稳定性进行了探讨。

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This paper introduces a new copper foil adhesive for bakelite paper laminate. The adhesive raises the comparative tracking index (CTI), proof welding, peel strength of the laminate.

本文介绍了一种新的覆铜板铜箔胶粘剂，应用于酚醛纸板上，具有较高的耐漏电起痕性；

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Packing hot melt adhesive: to be used for paper box paper carton food packing chocolate candy packing metallic foil cellophane and so on.

包装热熔胶——纸箱、纸盒、食品包装、巧克力糖果包装、金属箔、玻璃纸等。

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