The sensing element and the measuring ASIC are assembled in a dual-in-line (DIL) plastic package with pins for surface mount and re-flow soldering.

加速度计的敏感元及测量专用芯片（ASIC） 集成在DIL 塑料封装内，其引脚可用于表面安装和回流焊接。

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Design products process flow, e. g. for winding, soldering, assembly.

设计产品生产工艺流程，例如：绕线，焊接，装配。

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The content include finding appropriate components, studying appropriate proportion and optimization flow, and preparing better performance and economical soldering flux.

研究内容包括寻找合适的钎剂组分，研究各组分合适的配比和钎剂制备的工艺流程，制备出性能优越、经济性好的软钎剂。

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