倒装贴片电阻 (Flip Chips) FCR 系列: 倒装贴片电阻尺寸结构(FCR 系列),有 EIA ,0603EIA 0805,和 EIA 1206 系列标准提供。
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The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
Because of the compact design of flip chips and CSP on PCB, acoustic micro imaging has become extremely important for inspecting these packages.
由于在印制电路板上的倒装芯片和CSP器件的紧凑设计,声音微图像己经成为检测这些封装的非常重要的一部分。
The invention relates to a packaging method for flip LED chips, which belongs to the field of LED fabrication.
本发明涉及一种倒装led芯片的封装方法,属于LED制造领域。
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