The design describes the structure of compound die stamping flip-chip design and working process.
本次设计阐述了冲压倒装复合模的结构设计以及工作过程。
The process of flip chip based on aluminum nitride is studied.
研究了以氮化铝为基板的倒扣封装的工艺。
Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.
对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装（CSP）进行了研究，描述了CSP的工艺流程；
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