... flip chip integrated circuit 倒装芯片集成电路 flip chip method 倒装法 flip flop 触发电路 ...
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flip-chip method [电子] 倒装焊接法
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Thedrain saturation current is increased 10% after bonding. To disperse heat of GaNHEMT, this flip chip bonding method seems to be simple and effective.
实验结果表明，这种改进的倒装焊技术可以使HEMT 器件的饱和漏极电流提高10%。
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