GDSN ... Fixed Measure Trade Item Fixed Measure Trade Item 固定度量衡 FLIP Chip FLIP Chip 覆晶 FMCG Fast Moving Consumer Goods 快速移转消费产品 ...
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With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
采用多普勒激光振动测量系统，获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。
Electromigration induced Cu dissolution in flip chip Packages The phenomenon of Cu dissolution induced by electromigration at flip chip solder joints is reported.
覆晶封装中电迁移效应导致之铜溶解现象本論文报导覆晶封装之焊点中电迁移所引起之铜垫层快速溶解现象。
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