Flip Chip Technology 倒装焊技术 ; 倒装芯片技术
Flip-Chip Bonding Technology 覆晶组装技术
Flip Chip Bumping Technology 覆晶凸块技术
And the important role of advanced packagings such as CSP, BGA and Flip-chip technology in the microelectronics is described as well.
论述了如csp、BGA及倒装芯片等先进封装技术在微电子工业中所发挥的重要作用。
Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
覆晶技术已成为电子构装中之主要接合技术之一。
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