Method for preparing 1, 4-di (2, 4-diamino phenoxy) benzenoid form polyimide film for flexible copper clad plate.
柔性覆铜板用1,4 -双(2,4 -二氨基苯氧基)苯型聚酰亚胺薄膜的制备方法。
Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade.
印制电路用基材。第2部分:规范。第13号规范:通用级软覆铜聚酰亚胺薄膜,通用级。
Base materials for printed circuits. part 2: specifications. specification no 15: flexible copper - clad polyimide film, of defined flammability.
印刷电路用基材。第2部分:规范。15号规范:规定易燃性的包铜软聚酰亚胺薄膜。
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