The flattening process of a metal particle impacting onto another particle which …
并模拟了不同材料多个颗粒之间的相互作用过程。
Chemical-Mechanical % polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
Flattening and crack phenomenon happens constantly during the process of straightening , especially on thin tube.
圆形断面材料，尤其是薄壁管，在矫直过程中经常出现压扁和压纹现象。
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