The BGA quality is connected with electronic fitting technology, but further research is needed for BGA repair.
BGA器件的质量与电装工艺的关系密切,但BGA器件的返修还需作进一步的研究。
Sub-micron accuracy of displacement detection is obtained by adopting edge fitting technology and path matching technology.
该方法采用边界拟合和“路径匹配”技术,使位移量的检测精度达到了亚微米级。
Aiming at the closed fringe patterns gathered by CCD, image pretreatment technology, Coordinate transformation stripe center method and Zernike interferogram fitting technology were investigated.
针对CCD采集的闭合干涉条纹,研究了图像预处理技术、基于坐标变换的条纹中心法及泽尼克波面拟合技术。
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