The BGA quality is connected with electronic fitting technology, but further research is needed for BGA repair.
BGA器件的质量与电装工艺的关系密切,但BGA器件的返修还需作进一步的研究。
Sub-micron accuracy of displacement detection is obtained by adopting edge fitting technology and path matching technology.
该方法采用边界拟合和“路径匹配”技术,使位移量的检测精度达到了亚微米级。
The domestic origination entire automatic hot melt fitting technology, produces has the high stability, depends the corrosion, high sticksproperly, the high abrasive resistance drum brushes.
国内首创全自动热熔贴合技术,生产出具有高稳定性、赖腐蚀、高粘合度、高耐用度的滚筒刷。
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