Double sided polishing process has become a main machining method for silicon wafer finishing process, but it is difficult to get ultra-smooth surface with the very stringent machining conditions.
双面抛光已成为硅晶片的主要后续加工方法，但由于需要严格的加工条件，很难获得理想的超光滑表面。
Solder alloys are selected for their properties to flow, sealing ability, electrical conductivity, and for general body work to provide a smooth surface for finishing.
选择软焊合金时应考虑其流动性、密封能力和导电性，此外？以提供光滑的加工表面。
Except mechanical softening finishing, softening agent is also used to finish nonwovens in finishing process in order to make nonwovens have mellow and smooth feeling.
在后整理加工中，为了使非织造布具有滑爽、柔软的手感，除了用机械柔软整理外，还可用柔软剂进行整理。
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