8 1.2-1.5 1.2-1.5 0.9-1.2 0.6-0.9 0.5-0.6 最大晶圆直径 200mm 300mm 300mm 300mm 300mm 450mm 450mm 特征尺寸(Feature size)：通常是指集成电路中半导体器件的最小尺度，如MOS晶 体管的栅极长度。通常用特征尺寸来衡量集成电路的制造工艺水平。
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... fab：常指半导体生产的制造工厂。 feature size：特征尺寸，指单个图形的最小物理尺寸。 field-effect transistor（FET）：场效应管。包含源、漏、栅、衬四端，由源经栅到漏的多子流驱动而工作，多子流由栅下的横向电场控制。 ...
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regardless of feature size 不考虑形态尺寸
local feature size 局部特征尺寸
small feature size 小特征尺寸
device feature size 器件特征尺寸
minimum feature size 最小特征尺寸
Feature Size Frequency 特征大小频率
feature size downsizing 特征尺寸缩小
a minimum feature size 最小特征尺寸
RFS Regardless of Feature Size 不考虑形体尺寸
With the development of micro-manufacture technique and computer technology, the feature size of binary optical elements becomes smaller and smaller. If binary optical elements are designed by the scalar diffraction theory, it will lead very monstrous error.
随着微细加工工艺和计算机技术的发展,二元光学元件的特征尺寸进一步减小,利用标量衍射理论对其进行设计时将会产生较大误差,必须采用矢量衍射理论进行优化设计。
参考来源 - 二元光学元件矢量衍射设计与并行直写制作In recent years the scale of the integrate circuit become larger and larger, the feature size of wafer has become much smaller, to guarantee the quality in following process, the demand to surface precision of wafer is very serious.
近年来集成电路的规模越来越大,其所用芯片的特征尺寸越来越小,为保证后续加工的质量,对表面精度的要求是非常严格的。
参考来源 - 流体二维振动超光滑表面加工振动场分析与实验研究·2,447,543篇论文数据，部分数据来源于NoteExpress
The leakage power issue is challenging high-performance microprocessor design, especially as feature size shrinks.
随着工艺尺寸的缩小，漏流功耗逐渐成为制约微处理器设计的主要因素之一。
With the rapid development of microelectronics, the feature size of semiconductor devices is becoming smaller and smaller as predicted by Moore's Law.
随着微电子技术的飞速发展，半导体器件的特征尺寸按摩尔定律不断缩小。
As the technology is making progress rapidly in microelectronics, the feature size has reduced below 130nm, and the 65nm process has been in practical use.
微电子技术飞速进步，工艺特征尺寸已经减小到了130纳米以下，65纳米工艺已成为成熟工艺。
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