This paper presents a review of the characteristics and mechanisms of fatigue crack propagation(FCP)at near-threshold range in various metals and alloys.
本文回顾了各种金属及合金在门坎区附近的疲劳裂纹扩展的机制和特征。
The WLP technology that initiates processing from Wafer-Level and finishes in chip scale will be applicable on a daily broadening scale in plane array FCP.
在圆片规模上开始加工，结束于芯片规模的圆片级封装技术将在面型阵列倒装芯片的封装中得到日益广泛的应用。
A general mechanism of the effect of tensile overload on FCP behaviour is proposed.
提出了拉伸超载对疲劳裂纹扩展过程影响的一般机制。
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