In this thesis, the application of the failure analysis in MCP package technology will be addressed along with some general fa instrument and methods.
本文将主要讨论现阶段一般的封装失效分析的技术与设备，并且重点研究失效分析技术在多芯片封装领域的应用。
It is a crucial step for destructive physical analysis (DPA) and failure analysis (fa) to remove the plastic package for the die exposing.
去除塑料包封层，露出芯片表面，是DPA(破坏性物理分析)及FA(失效分析)的关键一步。
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