The prepared alloy appears the alternant structure with the Pb-based solid solution and the Pb-Sn eutectic.
制备的合金呈现出铅固溶体和铅锡共晶交替排列的结构。
Morphology transformation of eutectic silicon in Al-Si alloy during solid solution was observed by OM and SEM.
通过金相和扫描电镜观察研究了铸造铝硅合金中的共晶硅在固溶热处理过程中的形态变化。
Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.
通过这个电镀共沉积的过程，我们有可能用一种单一的方法将金锡合金固体焊料直接镀在晶片上的低共熔点上或其附近。
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