The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.

共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。

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Choi S. Lee J. Guo F Creep properties of eutectic SnAg solder and Sn- Ag composite solders containing intermetallic particles.

史耀武。闫焉服。刘建萍金属颗粒增强的锡铅基复合钎料及其制备方法。

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Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.

通过这个电镀共沉积的过程，我们有可能用一种单一的方法将金锡合金固体焊料直接镀在晶片上的低共熔点上或其附近。

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