The evolution of pro-eutectic austenite in semi-solid high chromium cast iron was studied by self-made slope sampling plate through metallographical image analysis system.

采用自行研制的倾斜取样板进行取样，并借助金相图像分析系统研究了半固态高铬铸铁先共晶奥氏体的衍变过程。

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Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.

通过这个电镀共沉积的过程，我们有可能用一种单一的方法将金锡合金固体焊料直接镀在晶片上的低共熔点上或其附近。

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