The grain boundary energy was measured with thermal etching method.

用热蚀刻方法测量了合金的晶界能。

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The crystal defects were studied by optical method and chemical etching method.

用光学法和化学腐蚀法研究了晶体的缺陷，并分析了缺陷成因。

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The results of testing show that the silicon (111) crystal plane is very smoothing by etching method.

测试结果表明，利用腐蚀方法得到的硅的(111)晶面周期结构平整光滑。

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This method allows better control of the thicknesses of the silicon and glass layers, but the etching is time-consuming and requires the costly sacrifice of a wafer for each one that is made.

ECONOMIST: Chip technology