The plasma is a high energy and high activity material, it has good etching effect for any organic material, which in recent years has also been referenced to the printed circuit board manufacturing.
由于等离子体是一种具有很高能量和极高活性的物质，它对于任何有机材料等都具有良好的蚀刻作用，因而在最近几年也被引用到印制电路板制造中来。
Based on the experiments, this article emphasizes the influence from aluminum and magnesium content to the etching performance of microcrystalline zinc board.
文章以实验为依据，着重探求了铝镁含量对微晶锌板蚀刻性能的影响。
The technology process and mechanism of etching are also discussed in detail with examples of hollowing board process.
结合镂空板工艺实例，详细介绍了工艺过程，并讨论了取得的效果与蚀刻机理。
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