Epoxy Resin Packaging Material 环氧树脂基封装材料
High power LED Lamp is characterized by small volume, light weight, epoxy resin packaging, good impact resistance and unbreakable property.
大功率LED灯体积小、重量轻，环氧树脂封装，可承受高强度机械冲击和震动，不易破碎。
A new production method of green electrical packaging material, which can resist fire and crack epoxy resin sealing compounds was introduced.
介绍了电子封装材料绿色阻燃耐开裂环氧树脂灌封料的生产新方法。
The invention relates to polyphenyl methylsiloxane modified epoxy resin and a manufacturing method of an electronic packaging material thereof.
本发明涉及聚苯基甲基乙氧基硅烷改性环氧树脂及其电子封装材料的制 法。
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