3806-34-6;抗氧剂 618;106-96-... ... Butyl acetate 乙酸丁酯 123-86-4 EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION 半导体包装用环氧树脂成型材料 TRIPHENYL PHOSPHATE FLAME RETARDANT 磷酸三苯酯耐燃剂 ...
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content of epoxy resin 环氧树脂含量
On the contrary, the tensile strength of the system improve with the increase of epoxy content.
与此相反的是，此体系的断裂强度则随环氧树脂用量的增加而提高。
The content of PTFE powder filled in the epoxy adhesive can affect the impact strength, adhesive strength, hardness and dry-wear property of the adhesive.
介绍用聚四氟乙烯粉填充于环氧胶中，研究了粉的含量对冲击强度、粘接强度、硬度、干磨性能的影响。
This paper introduces an improved test of soluble resin content in epoxy preimpregnated DMD material.
本文介绍了一种改进的环氧树脂预浸DMD可溶性树脂含量检测方法。
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