Molding pressure, Sinter temperature in advance and the velocity of temperature raised are the main factors for the matching of anode substrate and thin film YSZ electrolyte.
影响阳极基底与YSZ电解质薄膜共焙烧匹配性的主要因素是成型压力、预焙烧温度和焙烧升温速率。
Molding pressure, sinter temperature in advance and the raise velocity of temperature were the main influencing factors for the matching of anode substrate and thin film YSZ electrolyte.
影响阳极基底与YS Z电解质薄膜共焙烧匹配性的主要因素是成型压力、预焙烧温度和焙烧升温速率。
The conductivity of sputtered YSZ thin film is high and would be a good solid electrolyte for using in high temperature electrochemistry.
薄膜具有较高的电导率，完全可以作为固体电解质使用。
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