Chapter4 studied the copper wire bonding reliability capability and failure analysis method.
第四章对铜线键合封装的可靠性能力和失效分析方法进行了评估。
参考来源 - 铜线键合在多印线IC封装中的应用研究·2,447,543篇论文数据，部分数据来源于NoteExpress
If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
在芯片测试中，若引线焊盘上的铝层被探针扎穿，就会影响引线键合的牢固性和器件的可靠性。
There are so many process parameters affecting bond quality in wire bonding and these parameters are directly related to the reliability of semiconductor device.
引线键合过程中的工艺参数较多，他们直接影响键合质量的好坏，影响半导体器件的可靠性。
Statistical process control (SPC) technique is used to improve quality and reliability of microelectronic products, and monitor production conditions of wire bonding process.
采用统计过程控制(SPC)技术，提高微电路产品的质量和可靠性，监控键合工序的生产过程状态。
应用推荐