The result shows that the uniformity of film thickness can be improved if the rotation and time are selected properly.
结果表明，针对不同的膜料，合理选择转速和控制镀膜时间能够提高薄膜成膜的均匀性。
Finally, the key design parameters of coating system was obtained, this system can meet ITRS requirements on uniformity of film thickness.
最后给出了镀膜系统的关键设计参数，此镀膜系统能够满足ITRS关于膜厚均匀性的要求。
This revolving target improved on the usage of target material and uniformity of film thickness comparing with conventional cylindric magnetron sputtering target.
与常规的圆柱形磁控溅射靶相比较，该旋转式靶提高了靶材利用率和膜厚均匀度。
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