蚀铜不足 (Under Etching) 6.板子在蚀铜机内行径不直不正 检查水平 下压太大时,轻的板子会被举起 子液用完或管路堵塞 控制器故障或不准 抽风太强 了解干膜...
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The third stage etching in current method is a time-fixed etching, which easily causes under etching or over etching of the metal layer.
现有的刻蚀形成金属线时的第三阶段刻蚀采用了固定时间的刻蚀，极易造成金属层刻蚀不足或过刻蚀的问题。
The influence on over etching and under etching to IC layout is analyzed, the computation model and realization method of IC critical area are presented.
论文在分析过刻蚀和欠刻蚀对IC版图影响的基础上，提出了基于工艺偏差影响的IC关键面积计算新模型和实现方法。
Under this etching condition the sensitivity and the efficiency of the Fuji film for the registration of protons have been determined.
在此蚀刻条件下，测定了富士膜记录质子的灵敏度和效率。
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