The selectivity, the chemical and mechanical function's matching, the storage of the slurry and post CMP cleaning ULSI inlaid tungsten CMP have been studied in this article.
研究的是ULSI镶嵌钨CMP的选择性，化学与机械作用匹配，浆料的悬浮及存放和后清洗等问题。
The copper chemical-mechanical polishing (CMP) which is the key planarization technology for ULSI manufacturing was discussed.
对用于甚大规模集成电路(ULSI)制造的关键平坦化工艺———铜化学机械抛光(CMP)技术进行了讨论。
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