Vertical interconnections are typical structures in three dimensional microwave and millimeter wave integrated circuits.

垂直互连是三维微波和毫米波集成电路中的典型结构。

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Three-dimensional microelectronics focuses on the design and fabrication technology for 3-d integrated circuits.

三维微电子学主要研究三维集成电路的设计与制造。

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The engineers next demonstrated the possibilities of their techniques by creating the essential components of digital integrated systems: arithmetic circuits and sequential storage, as well as the first monolithic three-dimensional integrated circuits with extreme levels of integration.

ENGADGET: Stanford engineers find work around for barriers to carbon nanotube computers