High performance can be obtained for the integrated power electronics module (IPEM) by using a three-dimensional packaging structure instead of a planar structure.
采用三维封装结构取代传统的平面封装结构可获得高性能集成电力电子模块。
Three-dimensional solid model CAM module automatically.
凸轮三维实体模型自动生成模块。
System module is divided into three-dimensional model processing module and three-dimensional scene shows.
系统模块分为三维模型维护模块和三维场景显示模块。
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