A silicon piezoresistive sensor is applied here to in-situ record the curing stress profile, the distributions of the residual stress and the stress evolution profile during thermal treatment.
利用硅压阻传感器实时原位地记录粘接剂固化过程中的应力变化和残余应力的分布状况，以及在热处理过程中应力的演化过程。
Effects of water cooling on the strip thermal evolution and profile temperature distribution were studied and discussed.
讨论了机架间水冷对带钢传热和断面温度演变的影响。
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