The low sintering and low dielectrics substrate materials and their properties, and the organic additives for tape casting slurry are compared and analyzed.
对目前已研究和使用过的低介电常数和低烧结温度基板材料及综合性能,流延浆料有机添加剂进行了对比分析。
Experiments and studies show that the carbon-base or the resin-base additives can impede or reduce sintering.
通过试验研究表明,附加物能阻止陶瓷型烧结,使其清砂效率显著提高。
By using pressureless sintering technique, the ceramics corundum abrasives through the doping of MgO and SiO2 additives were prepared.
以氧化镁和氧化硅为烧结添加剂,利用无压烧结工艺制备了陶瓷刚玉磨料。
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