When establishing the optimization model, the material removal rate was set as one constrain.
设计优化数学模型时，将金属去除率作为一个约束条件。
The existence of the soft layer could increase the material volume removed by one particle and increase the material removal rate during CMP.
软质层的存在一方面增大单个磨料所去除材料的体积，增加材料去除速率；
Based on this mechanism, a new mathematical model characterizing the material removal rate in CMP process was developed by using micro-contact mechanics and particle size distribution theory.
基于这种机理，应用微观接触力学和磨粒粒度分布理论建立了一种新的表征CMP过程材料去除速率的数学模型。
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