The effects of surface electroplate pure copper on oxidation failure of lead frame copper alloys for IC package were investigated.
研究了在铜合金表面电镀纯铜层保护膜对铜合金引线框架氧化失效的影响。
The copper alloy strip of lead frame is the fundamental material for integrate circuit.
引线框架用铜带是集成电路的重要基础材料。
Features: The frame is made of high-quality copper, with electroplated chrome, strong corrosion-resistance.
产品特点： 框架用优质铜材制作，电镀亮铬，抗腐蚀能力强；
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