For NC machining of plane section method, the machining path of tool cutting plane and implicit surface can be found, and the curve of the tool path is drawn by the positive-negative method.
把隐函数的优势应用到数控加工编程中，即对于截面法的数控加工，求出刀具切削平面与隐函数曲面的加工轨迹，再用正负法绘制刀具轨迹曲线。
Double sided polishing process has become a main machining method for silicon wafer finishing process, but it is difficult to get ultra-smooth surface with the very stringent machining conditions.
双面抛光已成为硅晶片的主要后续加工方法，但由于需要严格的加工条件，很难获得理想的超光滑表面。
Using this method, the post-machining inner surface is obtained, and it makes the cutting locus planning in NC machining process possible.
在此基础上得到加工后内廓曲面，为数控加工中刀具轨迹的规划奠定了基础。
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