...1所示，选择电路板上大部分安装 元件的类型，是插针元件(Through-hole components)还是表面贴 装元件(Surface-mount components)。同时还要选择两个相邻焊 盘之间允许通过几条铜膜线。
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The wave soldering process may advance welding on the surface mount components damage. Now a lot of circuit board with surface mount components.
采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。现在很多电路板上以表面贴装元件为主。
Through hole components welding using traditional manual welding or soldering. The circuit board surface mount components and through-hole components mixed together.
传统的通孔元件的焊接采用波峰焊或手工焊接。目前电路板上表面贴装元件和通孔元件混合在一起。
The wave soldering process may advance welding on the surface mount components damage.
采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。
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