Based on the ideal shape model, variable thickness method is used to improve the uniformity of stress distribution of reflector, and the best thickness variation is determined.
在理想状态形状模型的基础上，提出了通过改变膜厚度方式改进反射面应力均匀度的方法，确定了最佳的反射面厚度变化规律。
The stress variation with temperature and isothermal relaxation in copper films deposited onto silicon wafers are studied by fixed point laser reflection method.
采用定点激光反射热循环方法，测量了硅基体上铜膜应力随温度的变化及等温松弛。
Crack growth was analyzed by using element eliminating method based on the variation of damage variable. Material flow, strain, stress and damage distribution of different steps was achieved.
根据损伤变量的变化，采用单元消除法分析了剪切裂纹的扩展，并得到了剪切各个段的金属流动、应力应变以及损伤变量分布。
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