In many issues of the reliability of copper interconnection, we place the emphasis on electromigration and stress migration.
在铜互连可靠性的几个主要问题中，重点针对互连中的电迁徙和应力迁徙进行了探讨。
参考来源 - ULSI中铜互连线可靠性的研究
应力迁移
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Stress migration
abstract:Stress Migration is a failure mechanism that often occurs in IC metallization (aluminum, copper). Voids form as result of vacancy migration driven by the hydrostatic stress gradient.