assembly stress 装配应力 ; 安装应力
low stress assembly 低应力组件
high stress assembly 高应力组件
interference assembly stress 过盈装配应力
assembly error stress 装配误差应力
assembly with low stress 低应力封装
For a typical assembly stress problem, digital simulation is conducted by means of the hybrid method with different numerical calculation methods.
针对一个典型的装配应力问题，运用不同的数值计算方法，对混合求解法进行了数值模拟。
As such, it is very important to protect microchips against ESD stress in electronics assembly industry.
因此，在电子制造行业里保护芯片免受静电放电的损害是非常重要的。
The pressing assembly is complex nonlinear mechanics, the stress and strain are difficult to be calculated analytically, and assembly principles is difficult to be mastered.
压合装配是一个复杂的非线性力学问题，其应力应变难以用解析方法计算，装配机理难以掌握。
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